Diglycidyl 4,5-epoxycyclohexane-1,2-dicarboxylate
Synonyms:Diglycidyl 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate; 4,5-Epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester
Molecular Formula:C14H18O7
Molecular Weight:298.29
CAS:25293-64-5
Purity:98%
Diglycidyl 4,5-epoxycyclohexane-1,2-dicarboxylate is mainly used in coatings, composites, adhesives, electronics, etc. The trifunctional epoxy resin having an alicyclic epoxy group and a glycidyl ester group in the molecular structure has both the characteristics of an alicyclic epoxy group and a glycidyl ester, and is also called a mixed epoxy resin. Due to the presence of highly reactive glycidyl ester groups, the reactivity is larger than that of common alicyclic epoxy resins, the epoxy value is higher, the viscosity is lower, and the solubility of the curing agent is better, and aliphatic and aromatic groups can be used. Amines, acid anhydrides and imidazoles are used as curing agents. The cured product has good thermal stability. The heat resistance temperature of Martin cured with m-phenylenediamine is 185 ° C, and the heat resistance temperature of Martin cured by anhydride is 156 ° C. The processing performance is good, and the cured product has high temperature resistance and high temperature. It has the characteristics of strength, high connectivity, weather resistance, low temperature resistance and electrical insulation. It can be used in many fields such as aviation, aerospace, nuclear power and electronics. The carbon fiber and glass fiber composite materials of the epoxy resin have been made into structural materials for high performance aircraft. In the nuclear power industry, it is applied to components with special mechanical properties. The resin can be made into high-strength, high-modulus sports equipment, high-temperature and high-voltage resistant outdoor power frequency equipment, high-temperature adhesive, solvent-free paint, high-temperature insulating cast and encapsulation. Materials, etc. It is used to prepare high temperature epoxy resin adhesive. The bonding strength is 6~8 times higher than that of E type epoxy resin at 150 °C, and the T-type peel strength is increased by 50%.
