Manufacturer selling hot polyimide monomer curing agent 3,3'-diamino diphenylsulfone; 3,3'-sulfonyldianiline
3,3'-Diamino diphenylsulfone be used for preparation polyimide and epoxy resin material.
3,3'-Diamino diphenylsulfone be used for preparation polyimide and epoxy resin material.
3,3'-sulfonyldianiline
Synonyms:3-Aminophenyl sulfone;
3,3'-Diamino diphenylsulfone;
Bis(3-aminophenyl) sulfone
Molecular Formula:C12H12N2O2S
Molecular Weight:248.30
CAS: 599-61-1
EINECS:209-967-5
Melting point:167-174 ºC
Purity:above 99%
3,3'-Diamino diphenylsulfone be used for preparation polyimide and epoxy resin material.