Manufacturer selling hot polyimide monomer curing agent 3,3'-diamino diphenylsulfone; 3,3'-sulfonyldianiline

3,3'-Diamino diphenylsulfone be used for preparation polyimide and epoxy resin material.

3,3'-sulfonyldianiline

Synonyms:3-Aminophenyl sulfone;

3,3'-Diamino diphenylsulfone;

Bis(3-aminophenyl) sulfone

Molecular Formula:C12H12N2O2S

Molecular Weight:248.30

CAS: 599-61-1

EINECS:209-967-5

Melting point:167-174 ºC

Purity:above 99%

3,3'-Diamino diphenylsulfone be used for preparation polyimide and epoxy resin material.